Green Sensing Platform (SIGGSP)

SIG Chair, Prof. Andy Wu

Connected context computing includes the research areas in sensing, connectivity, computing and applications. For sensing, the first goal is to develop high-efficiency, low-power, and low-cost chips and modules. Therefore, SIGGSP (Green Sensing Platform) intends to address the development, design, implementation, and optimization issues for smart sensor nodes (in contrast to the so-called dust nodes) for high-end sensor-network applications. As shown in figure 5, a sensor node consists of four major components: a processing unit (processor and memory element), a sensing unit (sensor and ADC), a transceiver unit (receiver and transmitter), and a power unit. To meet the future demand of M2M, SIGGSP aims to develop intelligent senor nodes (i-Sensor) by adding new features to current sensor node technology: the processing unit will be augmented with video coding and analysis units; the sensing unit will have various integrated sensors; the transceiver unit will be designed for ultra-low-power operations; and the power unit will be capable of capturing and storing energy from external sources in the ambient environment. The following research projects are being conducted:

  • Coding and Analysis Subsystems of Distributed Video Sensors

    The aim of this project is to develop coding and analysis subsystems for distributed video sensors that employ distributed video coding techniques to scale with the energy consumption/complexity of the sensor and aggregation nodes. A three- to four-fold improvement in power efficiency is expected for different platforms, including ASIC-based platforms or processor-based platforms.

 Sensor node structure. (a) Traditional sensor node;(b) Intelligent sensor node (iSensor).